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Now showing items 11-20 of 23
Microstructure evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu system lead free solder under long term thermal aging
(Scientific.Net, 2012-12)
Due to environmental concerns, lead-free solders were introduced in replacing the lead-based solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu solder was ...
Research development of solder materials and its intermetallic compound (IMC) study
(Scientific.Net/Trans Tech Publications, 2012-12)
Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems is a major issue in soldering. The excessive growth formation of intermetallic ...
Research advances of composite solder material fabricated via powder metallurgy route
(Scientific.Net/Trans Tech Publications, 2012-12)
Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder ...
The effects of tensile and morphological properties of Styrene Butadiene Rubber/Recycled Chloroprene Rubber (SBR/CRr) blends
(Scientific.Net, 2012-12)
The effects of tensile and morphological properties of styrene butadiene rubber/virgin chloroprene rubber blends (SBR/CRv) and styrene butadiene rubber/recycled chloroprene rubber blends (SBR/CRr) were investigated. The ...
Mechanical properties of ZTA composite using cold isostatic pressing and uniaxial pressing
(Trans Tech Publications, 2013)
Alumina-zirconia composite is an engineering material with a great potential to be develop for application as high temperature resistance structural material. In this research, zirconia toughness alumina (ZTA) was produced ...
Strength of concrete based cement using recycle ceramic waste as aggregate
(Trans Tech Publications, 2013)
The main focus of this research is to study the strength of concrete with ceramic waste as coarse aggregate. The sources of ceramic waste are obtained from the industrial in Malaysia. Presently, in ceramics industries the ...
Compressive strength and morphology of fly ash based geopolymer as artificial aggregate with different curing temperature
(Trans Tech Publications, 2014)
This paper presented the compressive strength of geopolymer paste with different NaOH concentration and morphology analysis for sintered artificial aggregate. This artificial aggregate was produce based on mix design with ...
Zn-Sn based high temperature solder - A short review
(Trans Tech Publications, 2013)
The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high ...
Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder
(Trans Tech Publications, 2014)
The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic devices industry. In this study, we used Sn-Cu-Si₃N₄ composite solder to observe the intermetallic compound ...
The effect of different sizes "Batu Reput" (Dolomite) as a filler in SMR L and ENR-50
(Trans Tech Publications, 2013)
The effects of different sizes of "Batu Reput" (Dolomite) filler which are smaller size (<63μm) and bigger size (75-150μm) on tensile and morphological properties of "Batu Reput" (Dolomite) filled SMR L and epoxidized ...