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Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder
(Trans Tech Publications, 2011-07-04)
A nanocomposite solder alloy with 99.3Sn-0.7Cu base alloy was successfully fabricated using the powder metallurgy route which consists of blending, compaction and sintering. Varying amount of nano size silicon nitride ...
Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder
(Elsevier B.V., 2012-10)
The use of reinforcing high performance ceramic particulates in monolithic lead-free solder is one way to improve the service temperature and mechanical behavior of a solder joint. In this study, various compositions of ...
Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
(Scientific.Net, 2012-12)
Feasibility of using recycled-Aluminum (re-Al) as reinforcement particulates in Sn-0.7Cu is assessed by powder technology method, whereby re-Al particulates are produced from discarded aluminum beverage cans. This paper ...