Browsing School of Materials Engineering (Articles) by Title
Now showing items 549-560 of 560
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Ultra-violet radiation-cured biofiber composites from kenaf: The effect of montmorillonite on the flexural and impact properties
(Taylor & Francis, 2010-04)Biofiber composites, cured by ultra-violet (UV) radiation were produced using kenaf fibers as the reinforcing agent and unsaturated polyester as the matrix. This research work focused on the effects of the incorporation ... -
Unsaturated polyester-kenaf composites: The effects of a modified montmorillonite filler on the tensile properties
(Taylor & Francis Group, LLC., 2010-06)This study has been embarked to use the nanofiller to compensate the adverse effect of the lignocellulosic filler. Unsaturated polyester-kenaf composites filled with various types of MMT filler were produced. The study ... -
Using gibbs standard state free energy and a power regulating device to predict and control the fabrication of nanoporous alumina
(VBRI press, 2013-12)The basic concept of Gibbs standard state free energy predicts a favorable condition for both room and high temperature fabrication of nanoporous alumina in phosphoric acid electrolyte. The anodization of aluminum foil in ... -
The utilisation of activated carbon (AC) from palm shell waste to treat textile wastewater
(AENSI Publisher All rights reserved., 2013-10)Heavy metals are widely used in textile industries and significant losses occur during the manufacturing and processing of textiles, and these lost heavy metals are eventually discharged in the effluent. Activated carbon ... -
Variation of half metallicity and magnetism of Cd₁₋xCrxZ (Z=S, Se and Te) DMS compounds on reducing dilute limit
(Elsevier (Imprint: NORTH-HOLLAND), 2013-04)The electronic and magnetic properties of Cr-doped Cd-Chalcogenides, Cd₁₋xCrxZ (Z=S, Se and Te) for dopant concentration, x=0.25 and 0.125 are presented in order to search new Dilute Magnetic Semiconductor (DMS) compounds ... -
Warpage analysis with straight drilled and conformal cooling channels on front panel housing by using taguchi method
(Trans Tech Publications, 2014)The challenging in injection molding process is to get the uniform thermal distribution on the molded parts during the cooling stage which is mainly depend on the design of the cooling channels in injection mold. Poor ... -
Wettability analysis on platinum deposited wafer after reactive ion ecthing using SF6+argon/CF4+argon gaseous
(AENSI Publisher All rights reserved, 2013-10)Wettability in microfluidic has direct influence to its fluid flow channels. This paper investigates the variable parameters that affect the wetability in terms of contact angle on a Platinum deposited wafer after reactive ... -
Wettability and interfacial phenomena investigations on high-density polyethylene and petroleum coke
(Wiley Periodicals, Inc., 2012-08)An in-depth wettability and interfacial phenomena investigation was carried out to study interactions between high density polyethylene (HDPE) and petroleum coke. The aim is to investigate the effect of temperature and ... -
Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder
(Trans Tech Publications, 2011-07-04)A nanocomposite solder alloy with 99.3Sn-0.7Cu base alloy was successfully fabricated using the powder metallurgy route which consists of blending, compaction and sintering. Varying amount of nano size silicon nitride ... -
Whiskers - a unique strengthening materials
(National Institute of Science Communication and Information Resources, 1985) -
X-ray photoelectron spectrum, X-ray diffraction data, and electronic structure of chalcogenide quaternary sulfide Ag2In 2GeS6: Experiment and theory
(Springer Science+Business Media, LLC, 2013-02)We report measurements of the X-ray diffraction and X-ray photoelectron spectrum on single crystals of Ag2In2GeS6. We also present first principles calculations of the band structure and density of states using the ... -
Zn-Sn based high temperature solder - A short review
(Trans Tech Publications, 2013)The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high ...