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Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication
(Trans Tech Publications, 2013)
The aim of this study was to optimize the compaction process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4 were carefully ...
Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
(Trans Tech Publications, 2014)
The aim of this study was to optimize the mixing process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si₃N₄ were carefully weighted, ...
Microstructure evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu system lead free solder under long term thermal aging
(Scientific.Net, 2012-12)
Due to environmental concerns, lead-free solders were introduced in replacing the lead-based solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu solder was ...
Research advances of composite solder material fabricated via powder metallurgy route
(Scientific.Net/Trans Tech Publications, 2012-12)
Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder ...
Wettability and shear strength of Sn-Cu-Ni-xSi3N4 composite solder
(Trans Tech Publications Ltd., 2016-07)
The wettability and mechanical properties of solder the joint of Sn-Cu-Ni-xSi3N4 had been investigated. In this study, five different silicon nitride (Si3N4) percentage addition were chosen (0 wt. %, 0.25 wt. %, 0.5 wt. ...
Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder
(Elsevier B.V., 2012-10)
The use of reinforcing high performance ceramic particulates in monolithic lead-free solder is one way to improve the service temperature and mechanical behavior of a solder joint. In this study, various compositions of ...
Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
(Scientific.Net, 2012-12)
Feasibility of using recycled-Aluminum (re-Al) as reinforcement particulates in Sn-0.7Cu is assessed by powder technology method, whereby re-Al particulates are produced from discarded aluminum beverage cans. This paper ...