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Fairul Afzal Ahmad Fuad
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Issue Date
Title
Author(s)
2013
5mm × 5mm sized slug on high power LED stress and junction temperature analysis
Zaliman, Sauli, Dr.
;
Retnasamy, Vithyacharan
;
Fairul Afzal, Ahmad Fuad
;
Ehkan, Phaklen, Dr.
;
Vairavan, Rajendaran
;
Nazuhusna, Khalid
;
zaliman@unimap.edu.my
;
vc.sundress@gmail.com
;
fairul@unimap.edu.my
;
phaklen@unimap.edu.my
;
nazuhusna@unimap.edu.my
2013
Shear speed analysis on Sn-3.9Ag-0.6Cu Solder
Zaliman, Sauli, Dr.
;
Retnasamy, Vithyacharan
;
Fairul Afzal, Ahmad Fuad
;
Ehkan, Phaklen, Dr.
;
Ong, Tee Say
;
Vairavan, Rajendaran
;
zaliman@unimap.edu.my
;
vc.sundress@gmail.com
;
fairul@unimap.edu.my
;
phaklen@unimap.edu.my
Discover
Author
2
Ehkan, Phaklen, Dr.
2
Fairul Afzal, Ahmad Fuad
2
Retnasamy, Vithyacharan
2
Vairavan, Rajendaran
2
Zaliman, Sauli, Dr.
.
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Subject
1
5mm × 5mm heat slug
1
Aluminum heat slug
1
Ball grid array (BGA)
1
Shear speed
1
Single chip LED
.
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Date issued
2
2013