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Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir.
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Dec-2012
Research development of solder materials and its intermetallic compound (IMC) study
Mohd Arif Anuar, Mohd Salleh
;
Najib Saedi, Ibrahim
;
Saud, N.
;
Mohd Mustafa Al Bakri, Abdullah
;
Nik Noriman, Zulkepli
;
Ramani, Mayapan
;
Zainal Ariffin, Ahmad
;
arifanuar@unimap.edu.my
;
najib8789@gmail.com
;
intanniza@yahoo.com
Oct-2016
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
Mohd Izrul Izwan, Ramli
;
Mohd Arif Anuar, Mohd Salleh
;
Mohd Nazree, Derman
;
Rita, Mohd Said
;
Norainiza, Saud
;
mohdizrulizwan@gmail.com
Feb-2021
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
Mohd Izrul Izwan, Ramli
;
Mohd Arif Anuar, Mohd Salleh
;
Rita, Mohd Said
;
Mohd Mustafa Al Bakri, Abdullah
;
Dewi Suriyani, Che Halin
;
Norainiza, Saud
;
Nabiałek, Marcin
;
Center of Excellence Geopolymer and Green Technology (CEGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP)
;
Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP)
;
Department of Physics, Czestochowa University of Technology
;
arifanuar@unimap.edu.my
Dec-2012
Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
Flora Somidin
;
Mohd Arif Anuar, Mohd Salleh
;
Khairel Rafezi, Ahmad, Dr.
;
florasom@gmail.com
;
arifanuar@unimap.edu.my
;
rafezi@unimap.edu.my
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Author
3
Mohd Arif Anuar, Mohd Salleh
2
Mohd Izrul Izwan, Ramli
2
Mohd Mustafa Al Bakri, Abdullah
2
Norainiza, Saud
2
Rita, Mohd Said
.
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1
Activated Carbon (AC)
1
Annealing process
1
Composite
1
Composite solder
1
IMC thickness
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Date issued
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2021
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2016
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2012