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Issue DateTitleAuthor(s)
2016An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste compositeNorainiza, Saud; Rita, Mohd Said; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Mohd Izrul Izwan, Ramli; Norhayanti, Mohd Nasir; norainiza@unimap.edu.my
Oct-2016Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite SolderMohd Izrul Izwan, Ramli; ‪Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Rita, Mohd Said; Norainiza, Saud; mohdizrulizwan@gmail.com
Jan-2021Microstructure evolution of Ag/TiO₂ thin filmDewi Suriyani, Che Halin; Kamrosni, Abdul Razak; Mohd Arif Anuar, Mohd Salleh; Mohd Izrul Izwan, Ramli; Mohd Mustafa Al Bakri, Abdullah; Ayu Wazira, Azhari; Kazuhiro, Nogita; Hideyuki, Yasuda; Nabiałek, Marcin; Wysłocki, Jerzy J.; Center of Excellence Geopolymer and Green Technology (CEGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP); Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP); Faculty of Civil Engineering Technology, Universiti Malaysia Perlis (UniMAP); School of Mechanical and Mining Engineering, The University of Queensland (UQ); Department of Materials Science and Engineering, Kyoto University; Department of Physics, Czestochowa University of Technology; dewisuriyani@unimap.edu.my
Feb-2021The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder jointMohd Izrul Izwan, Ramli; Mohd Arif Anuar, Mohd Salleh; Rita, Mohd Said; Mohd Mustafa Al Bakri, Abdullah; Dewi Suriyani, Che Halin; Norainiza, Saud; Nabiałek, Marcin; Center of Excellence Geopolymer and Green Technology (CEGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP); Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP); Department of Physics, Czestochowa University of Technology; arifanuar@unimap.edu.my

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