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Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir.
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Issue Date
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2016
An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
Norainiza, Saud
;
Rita, Mohd Said
;
Mohd Arif Anuar, Mohd Salleh
;
Mohd Nazree, Derman
;
Mohd Izrul Izwan, Ramli
;
Norhayanti, Mohd Nasir
;
norainiza@unimap.edu.my
Oct-2016
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
Mohd Izrul Izwan, Ramli
;
Mohd Arif Anuar, Mohd Salleh
;
Mohd Nazree, Derman
;
Rita, Mohd Said
;
Norainiza, Saud
;
mohdizrulizwan@gmail.com
Jan-2021
Microstructure evolution of Ag/TiO₂ thin film
Dewi Suriyani, Che Halin
;
Kamrosni, Abdul Razak
;
Mohd Arif Anuar, Mohd Salleh
;
Mohd Izrul Izwan, Ramli
;
Mohd Mustafa Al Bakri, Abdullah
;
Ayu Wazira, Azhari
;
Kazuhiro, Nogita
;
Hideyuki, Yasuda
;
Nabiałek, Marcin
;
Wysłocki, Jerzy J.
;
Center of Excellence Geopolymer and Green Technology (CEGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP)
;
Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP)
;
Faculty of Civil Engineering Technology, Universiti Malaysia Perlis (UniMAP)
;
School of Mechanical and Mining Engineering, The University of Queensland (UQ)
;
Department of Materials Science and Engineering, Kyoto University
;
Department of Physics, Czestochowa University of Technology
;
dewisuriyani@unimap.edu.my
Feb-2021
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
Mohd Izrul Izwan, Ramli
;
Mohd Arif Anuar, Mohd Salleh
;
Rita, Mohd Said
;
Mohd Mustafa Al Bakri, Abdullah
;
Dewi Suriyani, Che Halin
;
Norainiza, Saud
;
Nabiałek, Marcin
;
Center of Excellence Geopolymer and Green Technology (CEGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP)
;
Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP)
;
Department of Physics, Czestochowa University of Technology
;
arifanuar@unimap.edu.my
Discover
Author
3
Mohd Arif Anuar, Mohd Salleh
3
Norainiza, Saud
3
Rita, Mohd Said
2
Dewi Suriyani, Che Halin
2
Mohd Mustafa Al Bakri, Abdullah
.
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Subject
2
Intermetallic compound
2
Solder
1
Activated Carbon (AC)
1
Annealing process
1
IMC thickness
.
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Date issued
2
2021
2
2016