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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/26624
Title: Shear ram speed characterization for copper wire bond shear test
Authors: Zaliman, Sauli, Prof. Madya Dr.
Retnasamy, Vithyacharan
Ahmad Husni, Mohd Shapri
Norazeani, Abdul Rahman
Wan Mokhzani, Wan Norhaimi
Taniselass, Steven
Abdul Halis, Abdul Aziz
zaliman@unimap.edu.my
vc.sundres@gmail.com
Keywords: Shear ram speed
Shear test
Wirebond
Issue Date: 2012
Publisher: Trans Tech Publications, Switzerland.
Citation: Applied Mechanics and Materials, vol. 229-231, 2012, pages 670-673
Abstract: This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. The effects of the shear ram speed on the stress and strain response of the copper ball bond were investigated. A preliminary investigation confirms that shear ram speed has a significant effect on the von mises stress and equivalent strain response of the copper ball bond during wire bond shear test.
Description: Link to publisher's homepage at http://www.ttp.net/
URI: http://www.scientific.net/AMM.229-231.670
http://dspace.unimap.edu.my/123456789/26624
ISSN: 1660-9336
Appears in Collections:School of Microelectronic Engineering (Articles)
Steven Taniselass, Mr.
Zaliman Sauli, Lt. Kol. Professor Dr.
Vithyacharan Retnasamy

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