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dc.contributor.authorZaliman, Sauli, Prof. Madya Dr.-
dc.contributor.authorRetnasamy, Vithyacharan-
dc.contributor.authorAhmad Husni, Mohd Shapri-
dc.contributor.authorNorazeani, Abdul Rahman-
dc.contributor.authorWan Mokhzani, Wan Norhaimi-
dc.contributor.authorTaniselass, Steven-
dc.contributor.authorAbdul Halis, Abdul Aziz-
dc.date.accessioned2013-07-13T01:21:38Z-
dc.date.available2013-07-13T01:21:38Z-
dc.date.issued2012-
dc.identifier.citationApplied Mechanics and Materials, vol. 229-231, 2012, pages 670-673en_US
dc.identifier.issn1660-9336-
dc.identifier.urihttp://www.scientific.net/AMM.229-231.670-
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/26624-
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractThis paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. The effects of the shear ram speed on the stress and strain response of the copper ball bond were investigated. A preliminary investigation confirms that shear ram speed has a significant effect on the von mises stress and equivalent strain response of the copper ball bond during wire bond shear test.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publications, Switzerland.en_US
dc.subjectShear ram speeden_US
dc.subjectShear testen_US
dc.subjectWirebonden_US
dc.titleShear ram speed characterization for copper wire bond shear testen_US
dc.typeArticleen_US
dc.contributor.urlzaliman@unimap.edu.myen_US
dc.contributor.urlvc.sundres@gmail.comen_US
Appears in Collections:School of Microelectronic Engineering (Articles)
Steven Taniselass, Mr.
Zaliman Sauli, Lt. Kol. Professor Dr.
Vithyacharan Retnasamy

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