Preparation and characterization of Sn-Ag-Cu solder paste and Sn-Ag-Cu solder paste composite

Abstract

This study has been conducted to identify the effect of silicon carbide (SiC) when it is added to the tin-silver-copper solder paste. The amount of SiC added is varied from 0.25 wt%, 0.50 wt%, 0.75 wt% and 1.0 wt%. The solder paste was prepared with 88% metal content and 12% of flux by using the solder paste mixer. Then, SiC is mechanically mixed with the paste. The analyses done were carried out with specific equipment such as the used of differential scanning calorimetry to determine the melting point behavior, stencil printing to determine the paste printability, four points probe to determine the electrical resistivity, x-ray diffraction (XRD) examination to determine the qualitative analysis on the solder, scanning electron microscope (SEM) examination to analyze the intermetallic compound on the solder-substrate area, optical microscope to determine the solder wettability and vickers microhardness to determine the hardness value of the solder. It has been found that the addition of SiC on the solder has the slightest effect on the melting temperature, ease the the paste printing process, degrade the solder electrical conductivity, appeared in three different phase when observed by XRD, the SiC found deposited much on the top layer of the IMC layer, thickness of the IMC layer been decreasing up to 0.75 wt% SiC added and improving both the contact angle and hardness.