Browsing Institute of Nano Electronic Engineering (INEE) (Articles) by Subject "High temperature storage life"
Now showing items 1-2 of 2
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Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging
(American Society of Mechanical Engineers (ASME), 2013)Wearout reliability and high temperature storage life (HTSL) activation energy of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. ... -
Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
(Emerald Group Publishing Limited, 2013)Purpose - The purpose of this paper is to provide a systematic method to perform long-term reliability assessment of gold (Au) and copper (Cu) ball bonds in fineline ball grid array package. Also with the aim to study the ...