Browsing Institute of Nano Electronic Engineering (INEE) (Articles) by Subject "BGA package"
Now showing items 1-1 of 1
-
Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
(Emerald Group Publishing Limited, 2013)Purpose - The purpose of this paper is to provide a systematic method to perform long-term reliability assessment of gold (Au) and copper (Cu) ball bonds in fineline ball grid array package. Also with the aim to study the ...