Browsing Institute of Nano Electronic Engineering (INEE) (Articles) by Author "Classe, Francis"
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Extended reliability of gold and copper ball bonds in microelectronic packaging
Chong, Leong Gan; Classe, Francis; Bak, Lee Chan; Uda, Hashim, Prof. Dr. (World Gold Council, 2013-06)Wire bonding is the predominant mode of interconnection in microelectronic packaging. Gold wire bonding has been refined again and again to retain control of interconnect technology due to its ease of workability and years ... -
Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
Chong, Leong Gan; Classe, Francis; Uda, Hashim, Prof. Dr. (Emerald Group Publishing Limited, 2013)Purpose - The purpose of this paper is to provide a systematic method to perform long-term reliability assessment of gold (Au) and copper (Cu) ball bonds in fineline ball grid array package. Also with the aim to study the ... -
Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
Chong, Leong Gan; E., K. Ng; Bak, Lee Chan; Classe, Francis; Kwuanjai, T.; Uda, Hashim, Prof. Dr. (Hindawi Publishing Corporation, 2013)Wearout reliability and diffusion kinetics of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the HAST (with ...