| dc.contributor.author | Mohd Izrul Izwan, Ramli | |
| dc.contributor.author | Mohd Arif Anuar, Mohd Salleh | |
| dc.contributor.author | Mohd Nazree, Derman | |
| dc.contributor.author | Rita, Mohd Said | |
| dc.contributor.author | Norainiza, Saud | |
| dc.date.accessioned | 2020-11-16T04:23:43Z | |
| dc.date.available | 2020-11-16T04:23:43Z | |
| dc.date.issued | 2016-10 | |
| dc.identifier.citation | MATEC Web Conferences, vol.78, 2016, 7 pages | en_US |
| dc.identifier.issn | 2261-236X (online) | |
| dc.identifier.uri | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68728 | |
| dc.description | Link to publisher's homepage at https://www.matec-conferences.org/ | en_US |
| dc.description.abstract | The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %) were prepared via powder metallurgy (PM) technique. Interfacial IMC thickness measurement and shear strength results showed that with thinner IMC layer (by increasing amount of wt.% of AC), the higher the shear strength of the joint. It is believed that the AC particles suppresses the interfacial IMC growth and thus improves the shear strength. | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | EDP Sciences | en_US |
| dc.relation.ispartofseries | 2nd International Conference on Green Design and Manufacture 2016 (IConGDM 2016); | |
| dc.subject | Activated Carbon (AC) | en_US |
| dc.subject | Intermetallic compound | en_US |
| dc.subject | Solder | en_US |
| dc.title | Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder | en_US |
| dc.type | Article | en_US |
| dc.identifier.doi | https://doi.org/10.1051/matecconf/20167801064 | |
| dc.contributor.url | mohdizrulizwan@gmail.com | en_US |
