Browsing Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir. by Title
Now showing items 1-20 of 43
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Bonding strength characteristics of FA-based geopolymer paste as a repair material when applied on OPC substrate
(MDPI AG, 2020-05)This investigative study aims to study the mechanical and morphological properties of fly ash (FA)-based geopolymer paste as a repair material when applied on ordinary Portland cement (OPC) overlay concrete. The first part ... -
Bonding strength characteristics of FA-based geopolymer paste as a repair material when applied on OPC substrate
(MDPI AG, 2020-05)This investigative study aims to study the mechanical and morphological properties of fly ash (FA)-based geopolymer paste as a repair material when applied on ordinary Portland cement (OPC) overlay concrete. The first ... -
Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method
(Scientific.Net, 2012-04-12)The toxicity in the Sn-Pb solder has promoted the development of Pb-free solder in the electronics industries. Among the Pb-solders, the Sn-3.5Ag-1.0Cu solder is considered a potential replacement and being studied by many ... -
A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
(Syscom 18 SRL, 2013-07)The properties of Sn-0.7Cu solder bulk prepared via the powder metallurgy (PM) method were investigated and compared with solder bulk fabricated through casting. Distinct microstructures were observed in both PM and casting ... -
Compressive strength and morphology of fly ash based geopolymer as artificial aggregate with different curing temperature
(Trans Tech Publications, 2014)This paper presented the compressive strength of geopolymer paste with different NaOH concentration and morphology analysis for sintered artificial aggregate. This artificial aggregate was produce based on mix design with ... -
Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate
(Trans Tech Publications, 2013)The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic assemblies industry. In this investigation, we used Sn-0.7Cu/1.0-Si3N4 composite solder to analyze its ... -
The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
(Elsevier, 2019-10)This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the microstructure, electrical, wettability and mechanical properties of the Sn-0.7Cu-0.05Ni as a high strength solder. Besides using the ... -
The effect of different alkaline treatment condition on flexural properties of kenaf bast- unsaturated polyester composite
(Trans Tech Publications, 2013)The biocomposites were prepared by using kenaf bast fiber mat as reinforcing materials at different percentage. The kenaf bast fiber was treated with alkaline at different sodium hydroxide (NaOH) percentage. From the results ... -
The effect of different sizes "Batu Reput" (Dolomite) as a filler in SMR L and ENR-50
(Trans Tech Publications, 2013)The effects of different sizes of "Batu Reput" (Dolomite) filler which are smaller size (<63μm) and bigger size (75-150μm) on tensile and morphological properties of "Batu Reput" (Dolomite) filled SMR L and epoxidized ... -
Effect of graphene oxide on microstructure and optical properties of TiO₂ thin film
(IOP Publishing Ltd, 2019-12)GO/TiO₂ thin films have been synthesized from titanium (IV) isopropoxide (TTIP) by a sol-gel method. The films were deposited onto a glass substrate using spin coating deposition technique then were subjected to annealed ... -
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
(MDPI AG, 2021-02)The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength ... -
Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints
(Trans Tech Publications, 2013)Varying amount of recycled-Aluminium (0, 3.0, 3.5 and 4.0 wt.% re-Al) particulates produced from aluminium beverage cans were successfully reincorporated into Sn-0.7Cu base matrix solder material via powder metallurgy ... -
Graphene geopolymer hybrid: a review on mechanical properties and piezoelectric effect
(IOP Publishing Ltd, 2019-08)A review on graphene geopolymers hybrid is presented, focusing on the mechanical properties and piezoelectric effect. The method and way of mixing graphene with geopolymers are discussed, including form of graphene that ... -
High temperature creep and hydrogen embrittlement failure of a steam trap bypass tube
(Trans Tech Publications, 2013)A coal fired power plant with its normal operation temperature of 540°C in which its steam trap bypass tube in that power plant was totally fractured. The aim of this study is to explore the evidence related to the steam ... -
Hybrid mold: comparative study of rapid and hard tooling for injection molding application using Metal Epoxy Composite (MEC)
(MDPI AG, 2021-02)The mold-making industry is currently facing several challenges, including new competitors in the market as well as the increasing demand for a low volume of precision moldings. The purpose of this research is to appraise ... -
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
(EDP Sciences, 2016-10)The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. ... -
Influence of kaolin geopolymer ceramic additions to the wettability and electrical properties of Sn-3.0Ag-0.5Cu (SAC305) lead free solder
(IOP Publishing Ltd, 2019-12)The effect of kaolin geopolymer ceramic addition to the wettability and electrical resistivity of Sn-3.0Ag-0.5Cu (SAC305) lead free solder was successfully explored. Powder metallurgy with microwave sintering method was ... -
Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
(Scientific.Net, 2012-12)Feasibility of using recycled-Aluminum (re-Al) as reinforcement particulates in Sn-0.7Cu is assessed by powder technology method, whereby re-Al particulates are produced from discarded aluminum beverage cans. This paper ... -
An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
(EDP Sciences, 2016)In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution ... -
Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder
(Trans Tech Publications, 2014)The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic devices industry. In this study, we used Sn-Cu-Si₃N₄ composite solder to observe the intermetallic compound ...