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    An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite

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    Main article (950.6Kb)
    Date
    2016
    Author
    Norainiza, Saud
    Rita, Mohd Said
    Mohd Arif Anuar, Mohd Salleh
    Mohd Nazree, Derman
    Mohd Izrul Izwan, Ramli
    Norhayanti, Mohd Nasir
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    Abstract
    In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. Sn-Cu-Ni solder paste composite was produced by mixing TiO2 particle with Sn-Cu-Ni solder paste. The microstructure analysis was carried out by Scanning Electron Microscopy-Energy dispersive X-ray (SEM-EDX). The addition TiO2 particle helps to refine the bulk solder microstructure and suppress the intermetallic compound (IMC) formation at the interface as will be discussed further
    URI
    http://dspace.unimap.edu.my:80/xmlui/handle/123456789/69170
    Collections
    • Norainiza Saud, Ts Dr. [6]
    • Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir. [43]
    • Mohd Nazree Derman, Assoc. Prof. Dr. [66]

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