Total Visits

Views
Effect of isothermal aging to the intermetallic compound (IMC) growth of Sn-0.7Cu-1.0Si₃N₄ composite solder on copper substrate135

Total Visits Per Month

January 2024February 2024March 2024April 2024May 2024June 2024July 2024
Effect of isothermal aging to the intermetallic compound (IMC) growth of Sn-0.7Cu-1.0Si₃N₄ composite solder on copper substrate2100232

File Visits

Views
P.1-24.pdf55
Full Text.pdf1

Top country views

Views
United States60
Russia19
Malaysia18
Finland6
Germany5
China4
Vietnam4
Brazil3
Ireland3
France2

Top cities views

Views
Kuala Lumpur13
Boardman4
Buffalo4
Hanoi4
Dublin3
Boston2
Ceara Mirim2
Chicago2
Mountain View2
Andover1