Now showing items 1-20 of 54

    • Heart Caring "Handy" - Prototype 

      Retnasamy, Vithyacharan; R., Vijenthi; Sazali, Yaacob, Prof. Dr.; R., Nagarajan; Rizon, Juhari; Kenneth, Sundaraj; Shukry, Abd. Majid; Mohamad Hanif, Abd Hamid (Malaysian Invention and Design Society (MINDS), 2006-05-19)
      "Heart Carrying Handy" is designed to detect early abnormality in the heart pulse which will be deemed as a pre-heart attack sympton.
    • Complex background subtraction for biometric identification 

      Khalifa, Anouar Ben; Sundaraj, Kenneth, Prof. Dr.; Zaidah, Ibrahim; Retnasamy, Vithyacharan (IEEE Conference Publications, 2007)
      The background subtraction algorithm based on the YUV color space, image gradient and shape segmentation is used in this research to extract the region of interest from a real-time video surveillance camera. We choose to ...
    • Phase-map fringe pixel tracing for height computation 

      Retnasamy, Vithyacharan; Poopalan, Prabakaran, Assoc. Prof. Dr. (Institute of Electrical and Electronics of Engineering (IEEE), 2010-10-03)
      Fringe projection coupled with phase map generation has been used extensively for various applications namely in quality control sector of the industrial field. A phase map is generated from a multiple fringe projected ...
    • Velocity profiles and friction factor analysis of liquid flow in microstructured microchannel 

      Taniselass, S.; S. S., Najamudin; Retnasamy, Vithyacharan; Poopalan, Prabakaran, Assoc. Prof. Dr. (Universiti Malaysia Perlis (UniMAP)Centre for Graduate Studies, 2010-10-16)
      In this work, simulations were performed for the flow of water through rough microchannel taking into consideration a pressure-driven flow. Analysis on pressure drop, friction factor and velocity profile have been investigated ...
    • Micro-reservoir depth determination with Twyman-Green Interferometer 

      Wan Mokhdzani, Wan Nor Haimi; Poopalan, Prabakaran, Assoc. Prof. Dr.; Retnasamy, Vithyacharan; Mohd Naim, Haron (Universiti Malaysia Perlis (UniMAP)Centre for Graduate Studies, 2010-10-16)
      A micro-reservoir is fabricated on transparent silica wafer using Reactive Ion Etching (RIE). The depth of the micro-reservoir has been measured using profilometer, Atomic Force Microscopy (AFM) and Twyman Green-Interferometer. ...
    • Microchannel miter bend effects on pressure equalization and vortex formation 

      Taniselass, S.; Retnasamy, Vithyacharan; Poopalan, Prabakaran, Prof. Madya Dr. (Springer-Verlag, 2011)
      Simulations have been carried out for water flow in a square microchannel with a miter bend. The simulation considered a pressure-driven flow in a channel-hydraulic diameter of 5 μm for series of Reynolds number (Re) range ...
    • Shear ram speed characterization for copper wire bond shear test 

      Zaliman, Sauli, Prof. Madya Dr.; Retnasamy, Vithyacharan; Ahmad Husni, Mohd Shapri; Norazeani, Abdul Rahman; Wan Mokhzani, Wan Norhaimi; Taniselass, Steven; Abdul Halis, Abdul Aziz (Trans Tech Publications, Switzerland., 2012)
      This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ...
    • Simulation and characterization of MEMS piezoelectric thermal actuator 

      Palianysamy, Moganraj; Raman, Sathisvaran; Hasnizah, Aris; Retnasamy, Vithyacharan (Universiti Malaysia Perlis (UniMAP), 2012-06-18)
      The development of low cost MEMS devices has been the main focus in recent years. This leads to discovery of MEMS materials and suitable devices. Magnetostatic and electrostatic actuators produce relatively small forces; ...
    • Wire bond shear test simulation 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Wan Mokhzani, Wan Norhaimi (Universiti Malaysia Perlis (UniMAP), 2012-06-18)
      Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response ...
    • Silica microchannel fabrication using fluorine based rie with alas a mask 

      Wan Mokhzani, Wan Norhaimi; Retnasamy, Vithyacharan; Zaliman, Sauli, Assoc. Prof. Dr.; Taniselass, Steven; Ahmad Husni, Mohd Shapri; Norazeani, Abdul Rahman; Abdul Halis, Abdul Aziz (INSInet Publications, 2012-09)
      The silica microchannel fabrication process has been executed with Al thin films as the sacrificial layer during Reactive Ion Etching Process (RIE). CF4/Ar and SF6/Ar plasmas has been used to investigate etch rate of Al ...
    • Wire bond shear test simulation on sharp groove surface bond pad 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Ahmad Husni, Mohd Shapri; Vairavan, Rajendaran (Trans Tech Publications, 2012-12)
      Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ...
    • Polymer core BGA stress analysis at minimal vertical loading 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Steven, Taniselass; Norazeani, Abdul Rahman; Muhamad Hafiz, Ab Aziz (Trans Tech Publications, 2012-12)
      Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress ...
    • Shear ram height investigation for gold wire bond shear test 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Ahmad Husni, Mohd Shapri; Taniselass, Steven; Ong, T.S. (Trans Tech Publications, 2012-12)
      This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element ...
    • Wire bond shear test simulation on hemispherical surface bond pad 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Wan Mokhzani, Wan Norhaimi; Johari, Adnan, Assc. Prof. Dr.; Palianysamy, Moganraj (Trans Tech Publications, 2012-12)
      Wire bonding process is an interconnection method adopted in the semiconductor packaging manufactory. One of the method used to assess the reliability and bond strength of the bonded wires are wire bond shear test .In this ...
    • Aluminium surface grain size analysis on RIE treatment 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow (Trans Tech Publications (TTP), 2013)
      Reactive Ion Etch (RIE) has been an important process in the world of microelectronic fabrication. Focus of this preliminary study is on how RIE affects the grain size of aluminum film which is fabricated on substrates. ...
    • Relationship between controllable process parameters on bump height in ENIG 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Muhamad Hafiz,  Ab Aziz (Trans Tech Publications, 2013)
      This paper reports the factors that affect the bump height in electroless nickel immersion gold (ENIG) and their interrelation between each other. Bump height is a critical issue that needs to be investigated because a ...
    • Bump height at low temperature analysis 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Steven, Taniselass (Trans Tech Publications (TTP), 2013)
      The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ...
    • 5mm × 5mm sized slug on high power LED stress and junction temperature analysis 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Vairavan, Rajendaran; Nazuhusna, Khalid (Trans Tech Publications (TTP), 2013)
      Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and ...
    • Shear speed analysis on Sn-3.9Ag-0.6Cu Solder 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Ong, Tee Say; Vairavan, Rajendaran (Trans Tech Publications (TTP), 2013)
      Ball Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nano size. The reliability of BGA in IC becomes a concern as the size of IC reduces. ...
    • Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS 

      Yap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan (Emerald Group Publishing Limited, 2013)
      Purpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection ...