Wire bond shear test simulation
Zaliman, Sauli, Dr.
Wan Mokhzani, Wan Norhaimi
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Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response of the bonded wire during wire bond shear test.Comparisons between three types of wire material:gold(Au), aluminum(Al) and copper(Cu) were done to scrutinize the effects of wire material on the stress response of bonded wire during wire bond shear test. The simulation results showed that copper wire bond induces higher stress compared to aluminum and gold wire bond during wire bond shear test.