This page provides access to research works by Steven Taniselass, currently a Lecturer of School of Microelectronic Engineering, Universiti Malaysia Perlis.

News

Skills and Expertise:Finite Element Modeling,Microelectronics and Semiconductor Engineering,Microelectronics,Semiconductor Electronics,Semiconductor Fabrication and Semiconductor Device Modeling.

Recent Submissions

  • Bump height at low temperature analysis 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Steven, Taniselass (Trans Tech Publications (TTP), 2013)
    The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ...
  • WSS investigation in microfluidic FFS channel at Re 500 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Nor Shakirina, Nadzri; Hsio Mei, Tan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014-01)
    Wall shear stress (WSS) is one of the important variables in microfluidic devices. In this paper WSS distribution for a microfluidic device in Forward Facing Step (FFS) configuration has been investigated using Reynolds ...
  • Velocity profile investigation of FFS microchannel at Re 100 

    Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Taniselass, Steven; Nor Shakirina, Nadzri; Hsio Mei, Tan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014)
    Recently, microfluidics system has been widely employed in various areas for instance biomedical,pharmaceuticals and cell biological researchdue to its advantages. The flow behavior in microchannels with different ...
  • Wire bond shear test simulation on sharp groove surface bond pad 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Ahmad Husni, Mohd Shapri; Vairavan, Rajendaran (Trans Tech Publications, 2012-12)
    Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ...
  • Polymer core BGA stress analysis at minimal vertical loading 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Steven, Taniselass; Norazeani, Abdul Rahman; Muhamad Hafiz, Ab Aziz (Trans Tech Publications, 2012-12)
    Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress ...
  • Shear ram height investigation for gold wire bond shear test 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Ahmad Husni, Mohd Shapri; Taniselass, Steven; Ong, T.S. (Trans Tech Publications, 2012-12)
    This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element ...
  • Wire bond shear test simulation 

    Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Wan Mokhzani, Wan Norhaimi (Universiti Malaysia Perlis (UniMAP), 2012-06-18)
    Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response ...
  • Silica microchannel fabrication using fluorine based rie with alas a mask 

    Wan Mokhzani, Wan Norhaimi; Retnasamy, Vithyacharan; Zaliman, Sauli, Assoc. Prof. Dr.; Taniselass, Steven; Ahmad Husni, Mohd Shapri; Norazeani, Abdul Rahman; Abdul Halis, Abdul Aziz (INSInet Publications, 2012-09)
    The silica microchannel fabrication process has been executed with Al thin films as the sacrificial layer during Reactive Ion Etching Process (RIE). CF4/Ar and SF6/Ar plasmas has been used to investigate etch rate of Al ...
  • Shear ram speed characterization for copper wire bond shear test 

    Zaliman, Sauli, Prof. Madya Dr.; Retnasamy, Vithyacharan; Ahmad Husni, Mohd Shapri; Norazeani, Abdul Rahman; Wan Mokhzani, Wan Norhaimi; Taniselass, Steven; Abdul Halis, Abdul Aziz (Trans Tech Publications, Switzerland., 2012)
    This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ...