Steven Taniselass, Mr.
About Mr. Steven Taniselass
Mr. Steven Taniselass is currently a Lecturer at Faculty of Electronic Engineering Technology , Universiti Malaysia Perlis
He was formerly from School of Microelectronic Engineering
ORCID ID: https://orcid.org/
Scopus Author ID: 36998664900
Email: Steven Taniselass
Finite Element Modeling
Semiconductor Device Modeling
(Trans Tech Publications (TTP), 2013)The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ...
(Trans Tech Publications, 2014-01)Wall shear stress (WSS) is one of the important variables in microfluidic devices. In this paper WSS distribution for a microfluidic device in Forward Facing Step (FFS) configuration has been investigated using Reynolds ...
(Trans Tech Publications, 2014)Recently, microfluidics system has been widely employed in various areas for instance biomedical,pharmaceuticals and cell biological researchdue to its advantages. The flow behavior in microchannels with different ...
(Trans Tech Publications, 2012-12)Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ...
(Trans Tech Publications, 2012-12)Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress ...
(Trans Tech Publications, 2012-12)This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element ...
(Universiti Malaysia Perlis (UniMAP), 2012-06-18)Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response ...
(INSInet Publications, 2012-09)The silica microchannel fabrication process has been executed with Al thin films as the sacrificial layer during Reactive Ion Etching Process (RIE). CF4/Ar and SF6/Ar plasmas has been used to investigate etch rate of Al ...
(Trans Tech Publications, Switzerland., 2012)This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ...