Steven Taniselass, Mr.
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About Mr. Steven Taniselass
Mr. Steven Taniselass is currently a Lecturer at Faculty of Electronic Engineering Technology , Universiti Malaysia Perlis
He was formerly from School of Microelectronic Engineering
ORCID ID: https://orcid.org/
Scopus Author ID: 36998664900
Email: Steven Taniselass
Research Interests
Finite Element Modeling
Semiconductor Fabrication
Semiconductor Device Modeling
Microelectronics
Recent Submissions
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Bump height at low temperature analysis
(Trans Tech Publications (TTP), 2013)The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ... -
WSS investigation in microfluidic FFS channel at Re 500
(Trans Tech Publications, 2014-01)Wall shear stress (WSS) is one of the important variables in microfluidic devices. In this paper WSS distribution for a microfluidic device in Forward Facing Step (FFS) configuration has been investigated using Reynolds ... -
Velocity profile investigation of FFS microchannel at Re 100
(Trans Tech Publications, 2014)Recently, microfluidics system has been widely employed in various areas for instance biomedical,pharmaceuticals and cell biological researchdue to its advantages. The flow behavior in microchannels with different ... -
Wire bond shear test simulation on sharp groove surface bond pad
(Trans Tech Publications, 2012-12)Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ... -
Polymer core BGA stress analysis at minimal vertical loading
(Trans Tech Publications, 2012-12)Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress ... -
Shear ram height investigation for gold wire bond shear test
(Trans Tech Publications, 2012-12)This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element ... -
Wire bond shear test simulation
(Universiti Malaysia Perlis (UniMAP), 2012-06-18)Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response ... -
Silica microchannel fabrication using fluorine based rie with alas a mask
(INSInet Publications, 2012-09)The silica microchannel fabrication process has been executed with Al thin films as the sacrificial layer during Reactive Ion Etching Process (RIE). CF4/Ar and SF6/Ar plasmas has been used to investigate etch rate of Al ... -
Shear ram speed characterization for copper wire bond shear test
(Trans Tech Publications, Switzerland., 2012)This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ...
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