Browsing Zaliman Sauli, Lt. Kol. Professor Dr. by Issue Date

Now showing items 1-20 of 55

    • Symmetry energy of nuclear matter at low densities and clustering at the nuclear surface 

      Zaliman, Sauli, Dr.; Nooraihan, Abdullah; Khairul Anwar, Mohamad Khazali; Qamar Nasir, Usmani, Prof. Dr. (IOP Publishing Ltd, 2012)
      We present a density functional theory which connects nuclear matter equation of state, which incorporates clustering at low densities, with clustering in medium and heavy nuclei at the nuclear surface. This explains the ...

    • Shear ram speed characterization for copper wire bond shear test 

      Zaliman, Sauli, Prof. Madya Dr.; Retnasamy, Vithyacharan; Ahmad Husni, Mohd Shapri; Norazeani, Abdul Rahman; Wan Mokhzani, Wan Norhaimi; Taniselass, Steven; Abdul Halis, Abdul Aziz (Trans Tech Publications, Switzerland., 2012)
      This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ...

    • Design and analysis of film bulk acoustic wave resonator in Ku-band frequency for wireless communication 

      Nurul Izza, Mohd Nor; Shah, Kriyangbhai; Singh, Jugdutt, Prof.; Nazuhusna, Khalid, Dr.; Zaliman, Sauli, Prof. Madya Dr. (Society of Photo-Optical Instrumentation Engineers (SPIE), 2012-03-12)
      This paper presents design of a Film Bulk Acoustic Wave Resonators (FBARs) consisting of piezoelectric film, aluminium nitride (AlN) with top and bottom electrodes of ruthenium (Ru). The lumped Butterworth-Van Dyke (BVD) ...

    • Wire bond shear test simulation 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Wan Mokhzani, Wan Norhaimi (Universiti Malaysia Perlis (UniMAP), 2012-06-18)
      Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response ...

    • Silica microchannel fabrication using fluorine based rie with alas a mask 

      Wan Mokhzani, Wan Norhaimi; Retnasamy, Vithyacharan; Zaliman, Sauli, Assoc. Prof. Dr.; Taniselass, Steven; Ahmad Husni, Mohd Shapri; Norazeani, Abdul Rahman; Abdul Halis, Abdul Aziz (INSInet Publications, 2012-09)
      The silica microchannel fabrication process has been executed with Al thin films as the sacrificial layer during Reactive Ion Etching Process (RIE). CF4/Ar and SF6/Ar plasmas has been used to investigate etch rate of Al ...

    • Wire bond shear test simulation on sharp groove surface bond pad 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Ahmad Husni, Mohd Shapri; Vairavan, Rajendaran (Trans Tech Publications, 2012-12)
      Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ...

    • Polymer core BGA stress analysis at minimal vertical loading 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Steven, Taniselass; Norazeani, Abdul Rahman; Muhamad Hafiz, Ab Aziz (Trans Tech Publications, 2012-12)
      Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress ...

    • Shear ram height investigation for gold wire bond shear test 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Ahmad Husni, Mohd Shapri; Taniselass, Steven; Ong, T.S. (Trans Tech Publications, 2012-12)
      This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element ...

    • Wire bond shear test simulation on hemispherical surface bond pad 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Wan Mokhzani, Wan Norhaimi; Johari, Adnan, Assc. Prof. Dr.; Palianysamy, Moganraj (Trans Tech Publications, 2012-12)
      Wire bonding process is an interconnection method adopted in the semiconductor packaging manufactory. One of the method used to assess the reliability and bond strength of the bonded wires are wire bond shear test .In this ...

    • Aluminium surface grain size analysis on RIE treatment 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow (Trans Tech Publications (TTP), 2013)
      Reactive Ion Etch (RIE) has been an important process in the world of microelectronic fabrication. Focus of this preliminary study is on how RIE affects the grain size of aluminum film which is fabricated on substrates. ...

    • Relationship between controllable process parameters on bump height in ENIG 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Muhamad Hafiz,  Ab Aziz (Trans Tech Publications, 2013)
      This paper reports the factors that affect the bump height in electroless nickel immersion gold (ENIG) and their interrelation between each other. Bump height is a critical issue that needs to be investigated because a ...

    • Nuclear matter and surface clustering 

      Qamar Nasir, Usmani, Prof. Dr.; Nooraihan, Abdullah; Khairul Anwar, Mohamad Khazali; Zaliman, Sauli, Dr. (IOP Publishing Ltd, 2013)
      We demonstrate that the binding energy per nucleon of symmetric nuclear matter (SNM) (with Coulomb interaction switched off and N Z) in the limit of zero density approaches to its value, uv, at the saturation density, where ...

    • Bump height at low temperature analysis 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Steven, Taniselass (Trans Tech Publications (TTP), 2013)
      The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ...

    • 5mm × 5mm sized slug on high power LED stress and junction temperature analysis 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Vairavan, Rajendaran; Nazuhusna, Khalid (Trans Tech Publications (TTP), 2013)
      Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and ...

    • Shear speed analysis on Sn-3.9Ag-0.6Cu Solder 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Ong, Tee Say; Vairavan, Rajendaran (Trans Tech Publications (TTP), 2013)
      Ball Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nano size. The reliability of BGA in IC becomes a concern as the size of IC reduces. ...

    • Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS 

      Yap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan (Emerald Group Publishing Limited, 2013)
      Purpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection ...

    • Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology 

      Yap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Foong, Chee Seng; Tan, Chou Yong, Dr.; Retnasamy, Vithyacharan (Emerald Group Publishing Limited, 2013)
      Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment ...

    • Design and analysis of wideband ladder-type film bulk acoustic wave resonator filters in Ku-band 

      Nurul Izza, Mohd Nor, Dr.; Kriyang, Shah; Singh, Jugdutt; Zaliman, Sauli, Dr. (Hindawi Publishing Corporation, 2013)
      This paper presents the design of ladder-type filters based on film bulk acoustic wave resonator (FBAR) in Ku-band. The proposed FBAR filter has an insertion loss of -3 dB, out-of-band rejection of -12 dB and 3 dB bandwidth ...

    • Film bulk acoustic wave resonator filter for Ku-band applications 

      Nurul Izza, Mohd Nor, Dr.; Kriyang, Shah; Singh, Jugdutt; Zaliman, Sauli, Dr. (Trans Tech Publications (TTP), 2013)
      The design and analysis of Ku-band ladder-type filters based on film bulk acoustic wave resonator (FBAR) is presented. The proposed FBAR filter has an insertion loss of -3dB, out-of-band rejection of -12dB, centre frequency ...

    • Design and simulation of film bulk acoustic wave resonator in kuband 

      Nurul Izza, Mohd Nor, Dr.; Kriyang, Shah; Singh, Jugdutt; Zaliman, Sauli, Dr. (Trans Tech Publications, 2013)
      This paper presents the design of a Film Bulk Acoustic Wave Resonators (FBARs) operating in Ku-band. The one-dimensional (1-D) numerical and the three-dimension (3-D) Finite Element Method (FEM) simulation results are ...