Now showing items 1-3 of 3

    • Microfluidic channel depth determination with Tywman-Green interferometer 

      Wan Mokhdzani, Wan Nor Haimi; Zaliman, Sauli, Prof. Madya Dr.; Retnasamy, Vithyacharan; Taniselass, S.; N., Ramli; M. H. A. Aziz; R., Hatta (Springer-Verlag London., 2013-07)
      A microfluidic channel is fabricated on a silica wafer using reactive ion etching (RIE). The depth of the microfluidic channel has been measured using a surface profilometer and a Twyman-Green interferometer (TGI) setup. ...
    • Silica microchannel fabrication using fluorine based rie with alas a mask 

      Wan Mokhzani, Wan Norhaimi; Retnasamy, Vithyacharan; Zaliman, Sauli, Assoc. Prof. Dr.; Taniselass, Steven; Ahmad Husni, Mohd Shapri; Norazeani, Abdul Rahman; Abdul Halis, Abdul Aziz (INSInet Publications, 2012-09)
      The silica microchannel fabrication process has been executed with Al thin films as the sacrificial layer during Reactive Ion Etching Process (RIE). CF4/Ar and SF6/Ar plasmas has been used to investigate etch rate of Al ...
    • Wire bond shear test simulation 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Wan Mokhzani, Wan Norhaimi (Universiti Malaysia Perlis (UniMAP), 2012-06-18)
      Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response ...