Browsing Zaliman Sauli, Lt. Kol. Professor Dr. by Author "Ong, Tee Say"

Now showing items 1-5 of 5

    • Analysis on surface roughness and surface reflectance through DOE 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Ong, Tee Say (Trans Tech Publications, 2014)
      The Lambda 950 spectrometers are designed to investigate and examine surface coating on test specimen by using the light source. The objective of this research is to investigate the factors that affect the surface roughness ...

    • Fibrous material density difference analysis using light reflectance 

      Ong, Tee Say; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014)
      The objective of this work is designed and fabricated a lab module tester to differentiate the different type of printing paper quality which available commercially was done. Laser light source was used to differentiate ...

    • Fibrous material surface reflectance analysis 

      Ong, Tee Say; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Nur Izza, Mohd Nor; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014)
      The light inspection on surface finishing of most product measurement is an important feature in the industries. In this study, a lab module tester for examination on the different type quality of tissue paper quality was ...

    • Low density fibrous material surface light reflectance analysis 

      Ong, Tee Say; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      The light based surface finishing of most product measurement is an important feature in the industries. In this paper, a lab fabricated tester for investigation on the quality of low density paper which was represent by ...

    • Shear speed analysis on Sn-3.9Ag-0.6Cu Solder 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Ong, Tee Say; Vairavan, Rajendaran (Trans Tech Publications (TTP), 2013)
      Ball Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nano size. The reliability of BGA in IC becomes a concern as the size of IC reduces. ...