Browsing Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir. by Author "Rita, Mohd Said"
Now showing items 1-4 of 4
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The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
Mohd Izrul Izwan, Ramli; Mohd Arif Anuar, Mohd Salleh; Rita, Mohd Said; Mohd Mustafa Al Bakri, Abdullah; Dewi Suriyani, Che Halin; Norainiza, Saud; Nabiałek, Marcin (MDPI AG, 2021-02)The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength ... -
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
Mohd Izrul Izwan, Ramli; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Rita, Mohd Said; Norainiza, Saud (EDP Sciences, 2016-10)The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. ... -
An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
Norainiza, Saud; Rita, Mohd Said; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Mohd Izrul Izwan, Ramli; Norhayanti, Mohd Nasir (EDP Sciences, 2016)In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution ... -
Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
Nur Syahirah, Mohamad Zaimi; Mohd Arif Anuar, Mohd Salleh; Sandu, Andrei Victor; Mohd Mustafa Al Bakri, Abdullah; Norainiza, Saud; Shayfull Zamree, Abd Rahim; Vizureanu, Petrica; Rita, Mohd Said; Mohd Izrul, Izwan Ramli (MDPI AG, 2021-02)This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) ...