Browsing Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir. by Title
Now showing items 16-35 of 43
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Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
(EDP Sciences, 2016-10)The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. ... -
Influence of kaolin geopolymer ceramic additions to the wettability and electrical properties of Sn-3.0Ag-0.5Cu (SAC305) lead free solder
(IOP Publishing Ltd, 2019-12)The effect of kaolin geopolymer ceramic addition to the wettability and electrical resistivity of Sn-3.0Ag-0.5Cu (SAC305) lead free solder was successfully explored. Powder metallurgy with microwave sintering method was ... -
Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
(Scientific.Net, 2012-12)Feasibility of using recycled-Aluminum (re-Al) as reinforcement particulates in Sn-0.7Cu is assessed by powder technology method, whereby re-Al particulates are produced from discarded aluminum beverage cans. This paper ... -
An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
(EDP Sciences, 2016)In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution ... -
Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder
(Trans Tech Publications, 2014)The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic devices industry. In this study, we used Sn-Cu-Si₃N₄ composite solder to observe the intermetallic compound ... -
Mesoporous structure of doped and undoped PEG on Ag/TiO₂ thin film
(IOP Publishing Ltd, 2019-08)In this reaserch, photocatalyst silver titanium dioxide was doped and modified by Polyethylene Glycol (PEG). The purpose of the present study was to analyse the synthesized Ag/TiO₂ thin film doped and undoped PEG. Ag/TiO₂ ... -
Metallurgical failure analysis of a closed recirculation system water cooling pipe
(Trans Tech Publications, 2013)Catastrophic failure is often associated with a large temperature rise. This situation may lead to a drastic deterioration in material strength where a cooling system is important for a smooth system plant operation to ... -
Microstructural studies of doped PEG Ag/TiO₂ thin film
(IOP Publishing Ltd, 2019-12)Ag/TiO₂ thin film was prepared by the sol-gel method through the hydrolysis of titanium tetraisopropoxide and silver nitrate solution. Various amount of PEG was doped into the solution preparation to study the effect on ... -
Microstructure and wettability of Graphene Oxide/TiO2 thin film prepared via sol-gel method
(IOP Publishing Ltd, 2019-08)The microstructure of graphene oxide TiO2 (GO/TiO2) films on wettability and morphology properties were studied at different amount of Titanium isopropoxide with fixed amount of GO. GO/TiO2 thin films were prepared by using ... -
Microstructure evolution of Ag/TiO₂ thin film
(MDPI AG, 2021-01)Ag/TiO₂ thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO₂ thin films were elucidated using real-time synchrotron radiation imaging, its structure ... -
Microstructure studies on different types of Geopolymer materials
(Trans Tech Publications, 2013)Geopolymer is a new binding material produced to substitute the ordinary Portland cement (OPC) function as a binder in concrete. As we know, different types of geopolymer will have different properties. In this research, ... -
Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
(Trans Tech Publications, 2014)The aim of this study was to optimize the mixing process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si₃N₄ were carefully weighted, ... -
Natural rubber/styrene butadiene rubber/recycled nitrile glove (NR/SBR/rNBRg) ternary blend: Curing characteristics and swelling test
(Trans Tech Publications, 2014)Curing characteristics and swelling behavior of natural rubber/styrene butadiene rubber/recycled nitrile glove (NR/SBR/rNBRg) blends were investigated. Eleven composition ratio; 50/50/0, 50/40/10, 50/30/20, 50/20/30, ... -
Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review
(IOP Publishing Ltd, 2017-06)In this digital-age era, solder plays important role in electronic packaging industries. As interconnects material, solder provide an electrical and mechanical support to the electronics devices. Solder usually consist of ... -
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
(Trans Tech Publications, 2013)To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders. ... -
Overview of pathogenic micro-organisms destruction in contaminated water by oxide photocatalysis
(Trans Tech Publications, 2013)The titanium dioxide (TiO2) is a semiconductor oxide photocatalys, which is chemically and biologically inert but exhibits excellent photolytic activity in the ultraviolet (UV) region. Progress in photocatalytic water ... -
Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
(MDPI AG, 2021-02)This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) ... -
Phase study of titanium dioxide nanoparticle prepared via sol-gel process
(IOP Publishing Ltd, 2018-03)In this study, titanium dioxide nanoparticles have been prepared via sol-gel process using titanium tetraisopropoxide as a precursor with hydrochloric acid as a catalyst, and ethanol with deionized water as solvents. The ... -
Preparation of cyciopentyi trisiianoi siisesquioxanes - modified natural rubber (CpSSQ(OH)3 - ENR-50) composite hybrid in the presence of HCI acid
(Trans Tech Publications, 2013)A composite comprising cyclopentyl trisilanol siisesquioxanes (CpSSQ(OH)3) and 50% epoxidized natural rubber (ENR-50) was prepared at reflux temperature employed hydrochloric acid (HCl) as catalyst. HCl was found to be an ... -
Recent graphene oxide/TiO₂ thin film based on self-cleaning application
(IOP Publishing Ltd, 2019-08)Graphene oxide/TiO₂ (GO/TiO₂) thin films works as self-cleaning device have been developed in various method onto selected substrates. It was noticeable that graphene oxide is the best form in the group of graphene family. ...