Browsing Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir. by Title
Now showing items 19-38 of 43
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An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
(EDP Sciences, 2016)In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution ... -
Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder
(Trans Tech Publications, 2014)The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic devices industry. In this study, we used Sn-Cu-Si₃N₄ composite solder to observe the intermetallic compound ... -
Mesoporous structure of doped and undoped PEG on Ag/TiO₂ thin film
(IOP Publishing Ltd, 2019-08)In this reaserch, photocatalyst silver titanium dioxide was doped and modified by Polyethylene Glycol (PEG). The purpose of the present study was to analyse the synthesized Ag/TiO₂ thin film doped and undoped PEG. Ag/TiO₂ ... -
Metallurgical failure analysis of a closed recirculation system water cooling pipe
(Trans Tech Publications, 2013)Catastrophic failure is often associated with a large temperature rise. This situation may lead to a drastic deterioration in material strength where a cooling system is important for a smooth system plant operation to ... -
Microstructural studies of doped PEG Ag/TiO₂ thin film
(IOP Publishing Ltd, 2019-12)Ag/TiO₂ thin film was prepared by the sol-gel method through the hydrolysis of titanium tetraisopropoxide and silver nitrate solution. Various amount of PEG was doped into the solution preparation to study the effect on ... -
Microstructure and wettability of Graphene Oxide/TiO2 thin film prepared via sol-gel method
(IOP Publishing Ltd, 2019-08)The microstructure of graphene oxide TiO2 (GO/TiO2) films on wettability and morphology properties were studied at different amount of Titanium isopropoxide with fixed amount of GO. GO/TiO2 thin films were prepared by using ... -
Microstructure evolution of Ag/TiO₂ thin film
(MDPI AG, 2021-01)Ag/TiO₂ thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO₂ thin films were elucidated using real-time synchrotron radiation imaging, its structure ... -
Microstructure studies on different types of Geopolymer materials
(Trans Tech Publications, 2013)Geopolymer is a new binding material produced to substitute the ordinary Portland cement (OPC) function as a binder in concrete. As we know, different types of geopolymer will have different properties. In this research, ... -
Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
(Trans Tech Publications, 2014)The aim of this study was to optimize the mixing process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si₃N₄ were carefully weighted, ... -
Natural rubber/styrene butadiene rubber/recycled nitrile glove (NR/SBR/rNBRg) ternary blend: Curing characteristics and swelling test
(Trans Tech Publications, 2014)Curing characteristics and swelling behavior of natural rubber/styrene butadiene rubber/recycled nitrile glove (NR/SBR/rNBRg) blends were investigated. Eleven composition ratio; 50/50/0, 50/40/10, 50/30/20, 50/20/30, ... -
Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review
(IOP Publishing Ltd, 2017-06)In this digital-age era, solder plays important role in electronic packaging industries. As interconnects material, solder provide an electrical and mechanical support to the electronics devices. Solder usually consist of ... -
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
(Trans Tech Publications, 2013)To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders. ... -
Overview of pathogenic micro-organisms destruction in contaminated water by oxide photocatalysis
(Trans Tech Publications, 2013)The titanium dioxide (TiO2) is a semiconductor oxide photocatalys, which is chemically and biologically inert but exhibits excellent photolytic activity in the ultraviolet (UV) region. Progress in photocatalytic water ... -
Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
(MDPI AG, 2021-02)This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) ... -
Phase study of titanium dioxide nanoparticle prepared via sol-gel process
(IOP Publishing Ltd, 2018-03)In this study, titanium dioxide nanoparticles have been prepared via sol-gel process using titanium tetraisopropoxide as a precursor with hydrochloric acid as a catalyst, and ethanol with deionized water as solvents. The ... -
Preparation of cyciopentyi trisiianoi siisesquioxanes - modified natural rubber (CpSSQ(OH)3 - ENR-50) composite hybrid in the presence of HCI acid
(Trans Tech Publications, 2013)A composite comprising cyclopentyl trisilanol siisesquioxanes (CpSSQ(OH)3) and 50% epoxidized natural rubber (ENR-50) was prepared at reflux temperature employed hydrochloric acid (HCl) as catalyst. HCl was found to be an ... -
Recent graphene oxide/TiO₂ thin film based on self-cleaning application
(IOP Publishing Ltd, 2019-08)Graphene oxide/TiO₂ (GO/TiO₂) thin films works as self-cleaning device have been developed in various method onto selected substrates. It was noticeable that graphene oxide is the best form in the group of graphene family. ... -
Research advances of composite solder material fabricated via powder metallurgy route
(Scientific.Net/Trans Tech Publications, 2012-12)Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder ... -
Research development of solder materials and its intermetallic compound (IMC) study
(Scientific.Net/Trans Tech Publications, 2012-12)Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems is a major issue in soldering. The excessive growth formation of intermetallic ... -
A review of geopolymer ceramic as a potential reinforcement material in solder alloys
(IOP Publishing Ltd, 2019-12)Nowadays, lead-free solder has been currently used in electronic packaging technology as part of soldering material. Since SnPb was detected to produce toxicity and might harm the consumers, the usage of Pb solder has been ...