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dc.contributor.authorVeeradasan, Perumal
dc.contributor.authorUda, Hashim, Prof. Dr.
dc.contributor.authorTijjani Adam, Shuwa
dc.date.accessioned2014-04-09T04:00:03Z
dc.date.available2014-04-09T04:00:03Z
dc.date.issued2014
dc.identifier.citationAdvanced Materials Research, vol.832, 2014, pages 79-83en_US
dc.identifier.issn1662-8985
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/33542
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractIn Micro/Nanowire fabrication, the alignment and exposure process are the most critical steps in photolithography process, and indeed for the whole biochip processing. This process determines the success of transferring the Micro/Nanowire design pattern on the mask to the photoresists on the wafer surface. Hence, the resolution requirementsand precise alignment are vital; each mask needs to be precisely aligned with original alignment mark in order to transfer the original pattern from mask onto photoresist layer. Otherwise, itcant successfully transfer the original pattern to the wafer surface causing device and circuit failure. Therefore, the UniMAPs Second Generation Mask Aligner is used for precise alignment and pattern transfer process. Thus, the paper present a preliminary study on fundamentals of resist exposure and development mechanisms for fabrication of Micro/Nanowire, We demonstrated significance of considering process parameters such as mask aligner, quality of resist, soft bake, exposure time and intensity, and development time. There was a very little room for alignment error; we were able to achieved error free design to the criticaldimension.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectBiochipen_US
dc.subjectCritical dimensionen_US
dc.subjectMask aligneren_US
dc.subjectMicrowireen_US
dc.subjectPattern transferen_US
dc.titleMask design and fabrication of Micro/Nanowire biochip for reliable and repeatability pattern transferen_US
dc.typeArticleen_US
dc.identifier.urlhttp://www.scientific.net/AMR.832.79
dc.identifier.doi10.4028/www.scientific.net/AMR.832.79
dc.contributor.urlveerdasaan@hotmail.myen_US
dc.contributor.urluda@unimap.edu.myen_US
dc.contributor.urltijjaniadam@yahoo.comen_US


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