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The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)
(Trans Tech Publications, 2013)
The paper present the three dimensional numerical analysis of heat and fluid flow through Plastic Leaded Chip Carrier (PLCC) packages in inline orientation horizontally mounted on a printed circuit board in a wind tunnel ...
The effect of gap between plastic leaded chip carrier (PLCC) using computational fluid dynamic (CFD) software, FLUENT™
(AENSI Publisher All rights reserved, 2013-10)
This paper presents the effect of gap between Plastic Leaded Chip Carrier (PLCC) by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and ...
Development of nano-material (nano-silver) in electronic components application
(AENSI Publisher All rights reserved, 2013-10)
This paper presents the development of nano-material in electronic components especially in Plastic Leaded Chip Carrier (PLCC) application. The effect of nano-material in Plastic Leaded Chip Carrier (PLCC)will improve ...