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    Development of nano-material (nano-silver) in electronic components application

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    Development of nano-material (nano-silver) in electronic components application.pdf (448.0Kb)
    Date
    2013-10
    Author
    Mazlan, Mohamed
    Anizah, Kalam, Dr.
    Nik Rosli, Abdullah, Dr.
    Loo, Huck Soo, Prof. Madya Ir. Dr.
    Mohd Mustafa Al Bakri, Abdullah
    M. S., Abdul Aziz
    Khor, C. Y.
    Mohammad Amizi, Ayob
    Mohd Sukhairi, Mat Rasat
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    Abstract
    This paper presents the development of nano-material in electronic components especially in Plastic Leaded Chip Carrier (PLCC) application. The effect of nano-material in Plastic Leaded Chip Carrier (PLCC)will improve thermal resistance as well thermal performance in electronic application. This research is using three dimensional numerical analysis of heat and fluid flow in computer and3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for severalmicroprocessors arranged in line under different types of material, inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature and thermal resistance of each package. The junction temperature is been observed and it was found that the junction temperature of the microprocessors is not exceed 70°C. It also found that the application of nano-material in PLCC play important rolesto control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent.
    URI
    http://www.aensiweb.com/aeb_October-special_2013.html
    http://dspace.unimap.edu.my:80/dspace/handle/123456789/34271
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    • Mohd Mustafa Al Bakri Abdullah, Prof. Dr. [277]
    • Center of Excellence for Geopolymer and Green Technology (CEGEOGTECH) (Articles) [130]
    • School of Materials Engineering (Articles) [553]

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