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dc.contributor.authorUda, Hashim, Prof. Dr.
dc.contributor.authorM. Wesam, Al-Mufti
dc.contributor.authorTijjani Adam, Shuwa
dc.date.accessioned2014-03-27T07:52:48Z
dc.date.available2014-03-27T07:52:48Z
dc.date.issued2013
dc.identifier.citationAdvanced Materials Research, vol. 795, 2013, pages 669-673en_US
dc.identifier.isbn978-303785811-0
dc.identifier.issn1022-6680
dc.identifier.urihttp://www.scientific.net/AMR.795.669
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/33169
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractPoly-Silicon nanowire (Poly-Si-NW) simulations are very important field of nanotechnology and nanostructures; in this paper presented review in general nanowire and it applications such as thermoelectric device (TED) has potential applications in areas such as chip level cooling/ energy harvesting and many more applications in this field.COMSOL multiphysics is one of programmers using for nanotechnology and nanowires simulation, hence in this review paper, COMSOL simulation with different types of materials using for nanowire and other structures. Also In this work, we explore the effect of the electrical contact resistance on the performance of a TED. COMSOL simulations are performed on Poly-SiNW to investigate such effects on its cooling performance. Intrinsically, Poly-SiNW individually without the unwanted parasitic effect has excellent cooling power density. However, the cooling effect is undermined with the contribution of the electrical contact resistanceen_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectCOMSOL Multiphysicsen_US
dc.subjectNanostructureen_US
dc.subjectPoly-Si nanowireen_US
dc.subjectThermoelectric deviceen_US
dc.titleCurrent trend in simulation: A study simulation of Poly-Silicon nanowire using COMSOL multiphysicsen_US
dc.typeArticleen_US
dc.contributor.urluda@unimap.edu.myen_US
dc.contributor.urlmohamenw@gmail.comen_US
dc.contributor.urltijjaniadam@yahoo.com.myen_US


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