Statistics
Total Visits
| Views | |
|---|---|
| Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder | 304 |
Total Visits Per Month
| June 2025 | July 2025 | August 2025 | September 2025 | October 2025 | November 2025 | December 2025 | |
|---|---|---|---|---|---|---|---|
| Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder | 15 | 3 | 11 | 13 | 5 | 23 | 0 |
File Visits
| Views | |
|---|---|
| Intermetallic Compound Formation on Solder Alloy.pdf | 76 |
Top country views
| Views | |
|---|---|
| United States | 163 |
| China | 27 |
| Brazil | 12 |
| Germany | 11 |
| Ireland | 10 |
| Russia | 9 |
| Finland | 8 |
| Sweden | 7 |
| Canada | 6 |
| Senegal | 6 |
Top cities views
| Views | |
|---|---|
| Ashburn | 52 |
| San Mateo | 26 |
| Seattle | 13 |
| Dublin | 10 |
| Buffalo | 7 |
| Hangzhou | 6 |
| Boardman | 5 |
| Hanoi | 3 |
| Andover | 2 |
| Chengdu | 2 |