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Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication
(Trans Tech Publications, 2013)
The aim of this study was to optimize the compaction process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4 were carefully ...
Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder
(Elsevier B.V., 2012-10)
The use of reinforcing high performance ceramic particulates in monolithic lead-free solder is one way to improve the service temperature and mechanical behavior of a solder joint. In this study, various compositions of ...