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    Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder

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    Mechanical properties of Sn-0.7Cu-Si 3N 4 lead-free composite solder.pdf (21.87Kb)
    Date
    2012-10
    Author
    Mohd Arif Anuar, Mohd Salleh
    Mohd Mustafa Al-Bakri, Abdullah
    Muhammad Hafiz, Zan Hazizi
    Flora, Somidin
    Noor Farhani, Mohd Alui
    Zainal Arifin, Ahmad, Prof.
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    Abstract
    The use of reinforcing high performance ceramic particulates in monolithic lead-free solder is one way to improve the service temperature and mechanical behavior of a solder joint. In this study, various compositions of Sn-0.7Cu/Si 3N 4 lead-free composite solder were fabricated via the application of powder metallurgy (PM) techniques. The influences of the Si 3N 4 particulates in the monolithic matrix solder on the melting point temperature (T m), microhardness value, lap-shear strength, and surface fracture mechanisms were investigated based on the weight percentage addition used (0.5wt%, 1.0wt%, and 1.5wt%). Minimal alteration of the melting point temperature of the composite solder sample was obtained. Improvements in the microhardness value and lap-shear strength were found for higher reinforcements of Si 3N 4 particulates, which revealed the formation of a more ductile fracture mode in the composite solder samples. The increasing addition of Si 3N 4 allowed the formation of homogeneous and finer dimples. Overall, the addition of Si 3N 4 particulates to the Sn-0.7Cu lead-free solder should be higher than 1.0wt%, as these compositions showed superior mechanical properties.
    URI
    http://www.sciencedirect.com/science/article/pii/S0921509312010015
    http://dspace.unimap.edu.my/123456789/23648
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    • School of Materials Engineering (Articles) [553]
    • Muhammad Hafiz Zan@Hazizi, Mr. [2]
    • Mohd Mustafa Al Bakri Abdullah, Prof. Dr. [277]

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