Browsing School of Materials Engineering (Articles) by Subject "Lead-free solder"
Now showing items 1-5 of 5
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Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication
(Trans Tech Publications, 2013)The aim of this study was to optimize the compaction process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4 were carefully ... -
Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder
(Elsevier B.V., 2012-10)The use of reinforcing high performance ceramic particulates in monolithic lead-free solder is one way to improve the service temperature and mechanical behavior of a solder joint. In this study, various compositions of ... -
Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
(Trans Tech Publications, 2014)The aim of this study was to optimize the mixing process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si₃N₄ were carefully weighted, ... -
Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder
(Trans Tech Publications, 2011-07-04)A nanocomposite solder alloy with 99.3Sn-0.7Cu base alloy was successfully fabricated using the powder metallurgy route which consists of blending, compaction and sintering. Varying amount of nano size silicon nitride ... -
Zn-Sn based high temperature solder - A short review
(Trans Tech Publications, 2013)The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high ...