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Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives
Lin-Ngee, Ho; Teng, Fei Wu; Nishikawa, Hiroshi; Takemoto, Tadashi; Miyake, Koichi; Fujita, Masakazu; Ota, Koyu (Springer, 2011)The thermal stability and electrical reliability of electrically conductive adhesives (ECAs) filled with Cu fillers alloying with different amount of Ag and Mg (0.2-1.5 at.%), respectively, were studied by comparing their ...