Browsing Journal Articles by Author "hafizhazizi@unimap.edu.my"
Now showing items 1-5 of 5
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Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication
Muhamad Hafiz, Zan @ Hazizi; Mohd Arif Anuar, Mohd Salleh; Zainal Arifin, Ahmad, Prof.; Mohd Mustafa Al-Bakri, Abdullah; Alida, Abdullah; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (Trans Tech Publications, 2013)The aim of this study was to optimize the compaction process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4 were carefully ... -
Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder
Mohd Arif Anuar, Mohd Salleh; Mohd Mustafa Al-Bakri, Abdullah; Muhammad Hafiz, Zan Hazizi; Flora, Somidin; Noor Farhani, Mohd Alui; Zainal Arifin, Ahmad, Prof. (Elsevier B.V., 2012-10)The use of reinforcing high performance ceramic particulates in monolithic lead-free solder is one way to improve the service temperature and mechanical behavior of a solder joint. In this study, various compositions of ... -
Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
Muhammad Hafiz, Zan Hazizi; Mohd Arif Anuar, Mohd Salleh; Zainal Arifin, Ahmad, Prof. (Trans Tech Publications, 2014)The aim of this study was to optimize the mixing process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si₃N₄ were carefully weighted, ... -
Research advances of composite solder material fabricated via powder metallurgy route
Mohd Arif Anuar, Mohd Salleh; Muhammad Hafiz, Hazizi; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Ramani, Mayapan; Zainal Ariffin, Ahmad (Scientific.Net/Trans Tech Publications, 2012-12)Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder ... -
Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Khairel Rafezi, Ahmad, Dr.; Mohd Arif Anuar, Mohd Salleh; Muhammad Hafiz, Hazizi; Zainal Arifin, Ahmad, Prof. Dr. (Trans Tech Publications, 2011-07-04)A nanocomposite solder alloy with 99.3Sn-0.7Cu base alloy was successfully fabricated using the powder metallurgy route which consists of blending, compaction and sintering. Varying amount of nano size silicon nitride ...