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Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad
(Universiti Malaysia Perlis (UniMAP), 2013)
The advancement of technology in the micro and nano electronic niche has changed the
aspects of interconnection of electrical connectivity. Surface adhesion of electronic
device fabrication has propelled tribology element ...
Improved UMHexagonS algorithm and architecture for low power H.264 video compression
(Universiti Malaysia Perlis (UniMAP), 2013)
Video has been part of our daily life either for entertainment, work, or communication. The video can be used in form of television, movies, streaming video, video call or even for personal recording. The process of recording ...
Surface roughness and wettability investigation of varied plasma parameter effect on PVD deposited aluminium
(Universiti Malaysia Perlis (UniMAP), 2013)
Surface metrology has been a focused and thoroughly investigated research niche since the advent of device fabrication. The current technology shift into MEMS and nano has again made surface metrology a focused area. Layer ...
Portable shoe integrated instrumentation for gait analysis measurement using mems based devices
(Universiti Malaysia Perlis (UniMAP), 2013)
Gait analysis measurement is a method to access and identify gait events and the
measurements of dynamic and motion parameters involving the lower part of body. This
significant method is widely used in sports, rehabilitation ...
Development of reflectance intensity based microcontroller for fibre compactness analysis
(Universiti Malaysia Perlis (UniMAP), 2013)
Quality is an integral element in human life. All industries ranging from medical,
electronic, automotive, aviation, textile, food, to wood and paper possess some sort of
quality control element in both the output and ...
Preparation and characterization of bulk nanoporous Sn, SnO2 AND Zn
(Universiti Malaysia Perlis (UniMAP), 2013)
Extreme ultraviolet lithography (EUVL) has garnered much attention due to its potential in high-volume manufacturing (HVM) of integrated circuit (IC). This research contributes to the study of EUV source target. It has ...
High power led thermal dissipation analysis via slug and heat sink
(Universiti Malaysia Perlis (UniMAP), 2013)
High power light emitting diode (LED), are captivating attention in recent times due to
its cogent impacts on lighting industry in terms of efficacy, low power consumption,
long lifetime and miniature physical size. ...