Browsing School of Microelectronic Engineering (Theses) by Subject "Ball grid array (BGA)"
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Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2008)Thermal cycling test is one of the reliability test that has been used to evaluate the reliability of the solder joint interconnect in ball grid array (BGA) package. The purpose of thermal cycling test is to characterize ...