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Effect of isothermal aging to the intermetallic compound (IMC) growth of Sn-0.7Cu-1.0Si₃N₄ composite solder on copper substrate
(Universiti Malaysia Perlis (UniMAP), 2013)
The excessive growth of intermetallic compound (IMC) layer on solder joints has
become a challenging to the electronic packaging industry. Excessive IMC growth is a
barrier for the reliability of solder joints and the ...