Browsing School of Manufacturing Engineering (FYP) by Subject "Ball grid array (BGA)"
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Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component
(Universiti Malaysia Perlis (UniMAP)School of Manufacturing Engineering, 2009-05)The manufacturing of printed circuit board assembly (PCBA) is facing many problems especially in ball grid array (BGA) assembly. Therefore, it is important to focus on manufacturing process. Process improvement in this ...