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Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application
(Universiti Malaysia Perlis, 2008-03)
Shrinking size and increasing functionality of IC device has induced serious thermal problem. Good thermal dissipation, light weight and easy-to-process material, such as
CuSiC, is a highly potential heat spreader material ...