Browsing Final Year Project Papers & Reports by Author "Lim Moy Fung"
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Characterization of Intermetallic Growth in Gold Ballbonds on Aluminum Metallization
Lim Moy Fung (Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)The objective of this project is to study the capability of gold wire bonding process by investigating the intermetallic growth between gold ball bonds and aluminum bond pad. The study includes applying thermal storage ...