• Login
    View Item 
    •   DSpace Home
    • The Library
    • Conference Papers
    • View Item
    •   DSpace Home
    • The Library
    • Conference Papers
    • View Item
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad

    Thumbnail
    View/Open
    abstract.pdf (21.29Kb)
    Date
    2009-03-17
    Author
    Mohd Khairuddin, Md Arshad
    Lim, Moy Fung
    Uda, Hashim
    Zaliman, Sauli
    Metadata
    Show full item record
    Abstract
    This paper presents the study of the thermal aging of the gold ball bonds and aluminum bond pad at 150 °C and 200 °C for various interval times. Process decapsulation and Field Emission Scanning Electron Microscopy (FESEM) are used to reveal the intermetallic coverage and Kirkendall voiding. Energy Dispersive X-Ray (EDX) is then used to determine the intermetallic phase. The results shows that under thermal aging, the Kirkendall voids are seen, various intermetallic phases are detected and the intermetallic thickness increased tremendously at 200° C after 168 hrs as compared to 150 °C exposure times.
    URI
    http://www.electrochem.org/
    http://dspace.unimap.edu.my/123456789/7463
    Collections
    • Conference Papers [2599]
    • Uda Hashim, Prof. Ts. Dr. [243]

    Atmire NV

    Perpustakaan Tuanku Syed Faizuddin Putra (PTSFP) | Send Feedback
     

     

    Browse

    All of UniMAP Library Digital RepositoryCommunities & CollectionsBy Issue DateAuthorsTitlesSubjectsThis CollectionBy Issue DateAuthorsTitlesSubjects

    My Account

    LoginRegister

    Statistics

    View Usage Statistics

    Atmire NV

    Perpustakaan Tuanku Syed Faizuddin Putra (PTSFP) | Send Feedback