Optimization of Gating system in semiconductor packaging

Abstract

The development of three dimensional semiconductor packaging with embedded microchannel heat sinks were undertaken. Main purpose of the investigation was to gain more insights on the characteristics of the fluid flow motion and heat transfer in the semiconductor packaging. Several designs which consist of microchannel and manifold channel were simulated. The system was modelled using the Navier-Stokes equations and general heat transfer quations via declaring the stacked microchannel as a porous media. Location of the peak temperature was identified which occurred around sharp corners. Further investigations were carried out specifically on the region around the peak temperature and a new design was proposed to reduce the peak temperature and improve the temperature uniformity along the semiconductor packaging. It was found usage of a fillet design eliminates the swirling pattern in the microchannel bends which is the main cause of the relatively high peak temperature and non-uniform temperature distribution.