Effect of Potentiodynamic polerization scan rate on the corrosion performance of SN-0.7CU solder in salt solution

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dc.contributorSchool of Materials Engineeringen_US
dc.contributor.authorNuramira Shahira, Asmuni
dc.date2023-12
dc.date.accessioned2025-10-16T15:26:13Z
dc.date.issued2017-06
dc.descriptionAccess is limited to UniMAP community.en_US
dc.description.abstractTo investigate corrosion properties of Sn-0.7Cu solders at different scan rate in 3.5 wt% NaCl. To evaluate microstructure, elemental and phase evolution of Sn-0.7Cu solder after NaCl exposure. To study the corrosion mechanism of Sn-0.7Cu solder in 3.5 wt% NaCl.en_US
dc.identifier.urihttps://dspace.unimap.edu.my/handle/123456789/29363
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlis (UniMAP)en_US
dc.subject.otherMaterial engineeringen_US
dc.subject.otherSolderen_US
dc.subject.otherCorrosionen_US
dc.subject.otherSalt solutionen_US
dc.titleEffect of Potentiodynamic polerization scan rate on the corrosion performance of SN-0.7CU solder in salt solutionen_US
dc.typeLearning Objecten_US

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