Effect of Potentiodynamic polerization scan rate on the corrosion performance of SN-0.7CU solder in salt solution
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Universiti Malaysia Perlis (UniMAP)
Abstract
To investigate corrosion properties of Sn-0.7Cu solders at different scan rate in 3.5 wt% NaCl. To evaluate microstructure, elemental and phase evolution of Sn-0.7Cu solder after NaCl exposure. To study the corrosion mechanism of Sn-0.7Cu solder in 3.5 wt% NaCl.
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