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    • Extended reliability of gold and copper ball bonds in microelectronic packaging 

      Chong, Leong Gan; Classe, Francis; Bak, Lee Chan; Uda, Hashim, Prof. Dr. (World Gold Council, 2013-06)
      Wire bonding is the predominant mode of interconnection in microelectronic packaging. Gold wire bonding has been refined again and again to retain control of interconnect technology due to its ease of workability and years ...