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dc.contributor.authorF. Jikol
dc.contributor.authorM. Z. Akop
dc.contributor.authorY. M. Arifin
dc.contributor.authorM. A. Salim
dc.contributor.authorS. G. Herawan
dc.date.accessioned2022-01-14T02:08:50Z
dc.date.available2022-01-14T02:08:50Z
dc.date.issued2021-08
dc.identifier.citationInternational Journal of Nanoelectronics and Materials, vol.14(Special Issue), 2021, pages 479-488en_US
dc.identifier.issn1985-5761 (Printed)
dc.identifier.issn1997-4434 (Online)
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/73367
dc.descriptionLink to publisher's homepage at http://ijneam.unimap.edu.myen_US
dc.description.abstractThe purpose of this study is to investigate the thermal behavior of a circular-shaped hot plate when certain thermal load is applied. The hot plate is a part of hot surface deposition test equipment, and is placed on top of a heater block. The temperature distribution on the hot plate will indicate the highest temperature, and whether the temperature generated is as per required in the hot surface deposition test. Modelling of the heater block and the steady-state thermal analysis is conducted experimentally using ANSYS Release 16.2 software. The maximum temperature of the hot plate is compared to the applied temperature on the heater block. It is shown that there is dissimilarity of temperature between the hottest spot on the hot plate surface and the temperature applied. When conducting the real deposition test, the exact required temperature of the hot plate can be obtained by altering the temperature setting and measured accurately by using thermometer.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlis (UniMAP)en_US
dc.subject.otherHeat fluxen_US
dc.subject.otherHot plateen_US
dc.subject.otherMeshingen_US
dc.subject.otherSteady-state thermalen_US
dc.subject.otherTemperatureen_US
dc.titleA study of steady-state thermal distribution on circular plate using ANSYSen_US
dc.typeArticleen_US
dc.identifier.urlhttp://ijneam.unimap.edu.my


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