Norainiza Saud, Ts Dr.
Ts Dr. Norainiza Saud
Ts Dr. Norainiza Saud is currently a Senior Lecturer at Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis
He was formerly from School of Materials Engineering
ORCID ID: https://orcid.org/ 0000-0002-8198-5678
Scopus Author ID: 56352953900
Email: Norainiza Saud
(EDP Sciences, 2016)In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution ...
A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods (Syscom 18 SRL, 2013-07)The properties of Sn-0.7Cu solder bulk prepared via the powder metallurgy (PM) method were investigated and compared with solder bulk fabricated through casting. Distinct microstructures were observed in both PM and casting ...
(Trans Tech Publications, 2013)The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high ...
Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder (Trans Tech Publications, 2014)The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic devices industry. In this study, we used Sn-Cu-Si₃N₄ composite solder to observe the intermetallic compound ...
Corrosion performance of reinforcement bar in geopolymer concrete compare with its performance in ordinary portland cement concrete: A short review (Trans Tech Publications, 2013)Since decades ago, corrosion is the crucial factors for million dollars loss in construction industry. Corrosion of reinforcement bar in ordinary Portland cement (OPC) concrete is mainly due to chloride and acid attack and ...
(Universiti Malaysia Perlis, 2009-12-01)The microstructure study of eutectic Sn-Ag-Cu (SAC) and Sn-Ag solders during isothermal annealing has been investigated. Isothermal annealing temperatures were from 60ºC, to 150ºC for 24 up to 1008 hours of anneal time. ...