Norainiza Saud, Ts Dr.This page provides access to scholarly publication by UniMAP Faculty members and researchershttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/399802024-03-28T19:57:04Z2024-03-28T19:57:04ZAn investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste compositeNorainiza, SaudRita, Mohd SaidMohd Arif Anuar, Mohd SallehMohd Nazree, DermanMohd Izrul Izwan, RamliNorhayanti, Mohd Nasirhttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/691702020-12-30T01:56:44Z2016-01-01T00:00:00ZAn investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
Norainiza, Saud; Rita, Mohd Said; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Mohd Izrul Izwan, Ramli; Norhayanti, Mohd Nasir
In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. Sn-Cu-Ni solder paste composite was produced by mixing TiO2 particle with Sn-Cu-Ni solder paste. The microstructure analysis was carried out by Scanning Electron Microscopy-Energy dispersive X-ray (SEM-EDX). The addition TiO2 particle helps to refine the bulk solder microstructure and suppress the intermetallic compound (IMC) formation at the interface as will be discussed further
Link to publisher's homepage at https://www.matec-conferences.org/
2016-01-01T00:00:00ZA comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methodsMohd Arif Anuar, Mohd SallehMohd Mustafa Al Bakri, AbdullahSandu, Andrei VictorNorainiza, SaudKamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.McDonald, Stuart D.Nogita, Kazuhirohttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/357512014-06-20T08:29:20Z2013-07-01T00:00:00ZA comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
Mohd Arif Anuar, Mohd Salleh; Mohd Mustafa Al Bakri, Abdullah; Sandu, Andrei Victor; Norainiza, Saud; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; McDonald, Stuart D.; Nogita, Kazuhiro
The properties of Sn-0.7Cu solder bulk prepared via the powder metallurgy (PM) method were investigated and compared with solder bulk fabricated through casting. Distinct microstructures were observed in both PM and casting Sn-0.7Cu solder bulks. PM Sn-0.7Cu solder showed denser and finer Sn-grain structure, while cast Sn-0.7Cu showed larger Sn-rich dendrites with the presence of eutectic phase region. The mechanical performance of the solder bulk prepared with the PM technique was enhanced as it had higher microhardness value, UTS, and yield strength compared to the solder bulk prepared using the casting method. The solder wettability of the product was also increased using the PM method. Overall, the PM method can improve the mechanical and solderability properties of lead-free solder; therefore, it holds great potential as a new method for solder fabrication.
Link to publisher's homepage at http://syscom.ro/
2013-07-01T00:00:00ZZn-Sn based high temperature solder - A short reviewSayyidah Amnah, MusaMohd Arif Anuar, Mohd SallehNorainiza, Saudhttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/348552014-05-29T04:40:50Z2013-01-01T00:00:00ZZn-Sn based high temperature solder - A short review
Sayyidah Amnah, Musa; Mohd Arif Anuar, Mohd Salleh; Norainiza, Saud
The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high temperature solders. The lead and lead-based compound are highly toxic which is dangerous to human health and environment. The highly suitable lead- free solder candidates for replacing high Pb high temperature solder are Au-Sn, Al-Zn, Zn-Sn, Sn-Sb, and Bi-Ag solders. However, Zn-Sn based solder has highly recommended as the best candidates in replacing high lead high temperature solder. This paper provides a short review of recent research on Zn-Sn based lead free high temperature solders with different additional alloying elements. The new novel alloy of Zn-Sn based for high temperature solder applications will be proposed in this paper.
Link to publisher's homepage at http://www.ttp.net/
2013-01-01T00:00:00ZLow and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solderNorainiza, SaudNajib Saedi, IbrahimMohd Arif Anuar, Mohd Sallehhttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/345092014-05-19T08:43:27Z2014-01-01T00:00:00ZLow and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder
Norainiza, Saud; Najib Saedi, Ibrahim; Mohd Arif Anuar, Mohd Salleh
The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic devices industry. In this study, we used Sn-Cu-Si₃N₄ composite solder to observe the intermetallic compound (IMC) growth during low and high temperature aging. 50°C and 150°C represent low and high aging temperature respectively. Various isothermal of aging times were carried out by using 24hrs, 240hrs and 720hrs. The IMC thickness increases with increasing of aging temperature and time. Cu6Sn5 phase appear at low aging temperature whilst Cu6Sn5 together with Cu3Sn phases has been observed at high aging temperature. The growth kinetics for low and high aging temperature is 1.63x10⁻¹⁸μm2/s and 2.75 x10⁻¹⁸μm2/s.
Link to publisher's homepage at http://www.ttp.net/
2014-01-01T00:00:00Z